“I had the incredible luck to partner with Manzur as his teammate while working towards our MBAs at Duke University | The Fuqua School of Business. Manzur is everything you'd expect a Ph.D. to be: logical, analytical, and a master of getting to the root of complex problems. Breaking stereotypes about "hard science" practitioners, he is also a balanced leader and manager, willing to listen and weigh his team members' ideas and suggestions. After considering all inputs: he takes action. There is no doubt in my mind that Manzur will improve the success and consistency of any organization for which he chooses to work.”
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We’re witnessing a clear divergence in the semiconductor ecosystem. Silicon IP is thriving — fueled by the chiplet revolution, soaring AI workloads…
We’re witnessing a clear divergence in the semiconductor ecosystem. Silicon IP is thriving — fueled by the chiplet revolution, soaring AI workloads…
Shared by Manzur Rahman, PhD, MBA
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Meta unveils Hyperion, plans to build 5GW of Data Centers, and will invest "hundreds of billions of dollars into compute to build superintelligence."…
Meta unveils Hyperion, plans to build 5GW of Data Centers, and will invest "hundreds of billions of dollars into compute to build superintelligence."…
Liked by Manzur Rahman, PhD, MBA
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🚀 Launching 5G from orbit: AccelerComm Ltd’s satellite leap The future of connectivity is going cosmic, with 5G space-based non-terrestrial networks…
🚀 Launching 5G from orbit: AccelerComm Ltd’s satellite leap The future of connectivity is going cosmic, with 5G space-based non-terrestrial networks…
Shared by Manzur Rahman, PhD, MBA
Experience & Education
Licenses & Certifications
Publications
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A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem
IEEE ISSCC
This paper describes a new CPU subsystem featured in a 5G mobile SoC. The High-Performance (HP) core achieves a 3GHz clock frequency with full production yield across the fabrication range and operating environment. In contrast to previously published work [1], a third, balanced-performance (BP), gear is introduced which features a power-optimized implementation of the high-performance (HP) core. Physical implementation differences of the BP and HP cores are illustrated, while circuit…
This paper describes a new CPU subsystem featured in a 5G mobile SoC. The High-Performance (HP) core achieves a 3GHz clock frequency with full production yield across the fabrication range and operating environment. In contrast to previously published work [1], a third, balanced-performance (BP), gear is introduced which features a power-optimized implementation of the high-performance (HP) core. Physical implementation differences of the BP and HP cores are illustrated, while circuit techniques developed to enable full-yield 3GHz operation are detailed.
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• Rahman, M.M.; Kabir, M.N.; Rashid, S.M.S.;"Microprocessor Based Design of the ControlMechanism of Automatic Mail Sorting Machine "
proceeding of International Conference on Computer Science and Software Engineering (CSSE), pp-1170- 1176,Volume-1,2008.
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L Chen, Manzur Rahman and Nan Sun ,”A Fast Radix-3 SAR Analog-to-Digital Converter ” MWCAS 2013.
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Manzur et al “A novel hybrid radix-3/radix-2 SAR ADC with fast convergence and low hardware complexity,” IEEE Transactions on Circuits and Systems – II: Express Briefs, vol. 62, May 2015.
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Manzur et al,”Algorithm and Implementation of Digital Calibration of Fast Converging Radix-3 SAR ADC," ISACS 2014
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Rahman, M.M.; Talukder, A.; "A Theoretical Approach for Familiarization with Techniques of Interleaved Echo-Planar Imaging for Functional Magnetic Resonance Imaging and Their Features”
International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE 2008) ,pp-143-148,2008
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Rahman, S.N.; Faraby, H.M.; Rahman, M.M, "A Theoretical Analysis Of Electrostatic Properties of <110> Uniaxially Strained Silicon n-Channel MOSFET”,
Proceedings of Student Paper Contest, IEEE Electron Device Society Bangladesh Chapter, pp. 5-8, 2007.
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Rahman, S.N.; Faraby, H.M.; Rahman, M.M.; Huda, M.Q.; Haque, A.; "Inversion Layer Properties of < 110 > Uniaxially Strained Silicon n-channel MOSFETs",
International Conference on Electrical and Computer Engineering (ICECE),pp-438-441,2008.
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Big news for America’s AI future: a bold $6 billion commitment from CoreWeave to build a 100MW AI data center in Lancaster, PA — with plans to scale…
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In a bold step forward, we are proud to announce our intent to commit more than $6 billion to equip a 100MW state-of-the-art AI data center in…
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We are honored to announce the appointment of Lip-Bu Tan, CEO of Intel Corporation, to the GSA Board of Directors. As a distinguished leader…
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NVIDIA pulled off what many thought impossible, regulatory approval to export its H20 AI chips to China. This isn’t just smart engineering; it’s a…
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The semiconductor industry is entering a new era — one where innovation isn’t just about shrinking nodes, but about fostering startup-led…
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AI at hyperscale is no longer just a concept — it’s here. Dell Technologies CoreWeave and NVIDIA have teamed up to deliver the world’s first…
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🚀 Japanese Chip Assemblers Unite for Resilience & Efficiency Japan’s leading chip assembly and test (OSAT) providers are forging partnerships to…
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A seismic shift is underway in data center CPUs — and it’s all about Arm and AMD. Here’s what’s driving this transformation: ✅ Arm’s meteoric…
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Our partnership with CoreWeave and NVIDIA continues to set the pace. Proud to deliver the world’s first GB300 NVL72 with 50x inference throughput…
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🚀 Singapore's Semiconductor Renaissance: A Global Packaging Powerhouse Singapore is rapidly emerging as a leader in advanced chip packaging…
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Excited to share a major leap forward in semiconductor innovation—Synopsys Inc and Samsung Electronics Foundry are combining their strengths to…
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